GENEVA, March 9 -- S & W VERPACKUNGEN GMBH (Anna-Schneider-Steig 950678 Koln) filed a patent application (PCT/EP2024/073823) for "FILM-FREE PACKAGING" on Aug 26, 2024. With publication no. WO/2025/045822, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HEINECKE, Steffen (HochstraBe 8a35315 Homberg / Ohm), VILLWOCK, Karina (ArndtstraBe 2024943 Flensburg)
Abstract:
The invention relates to a printed substrate, preferably for producing paper-based packaging, having a backing layer which has at least one paper layer, where...