GENEVA, Dec. 29 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2025/066526) for "VIA-CONNECTED TOP SUBSTRATE OF A POWER MODULE" on Jun 13, 2025. With publication no. WO/2025/261911, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GOLLHOFER, Stephanie (Steinenbergstr. 44/172764 Reutlingen), ZANDER, Frank (Nordring 772108 Rottenburg Am Neckar), ZAHN, Tobias (Mutter-Teresa-Strasse 68/472108 Rottenburg), KEIL, Johannes (Sebastian-Kneipp-Weg 1/172800 Eningen Unter Achalm), STECK, Mart...