GENEVA, Feb. 24 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2024/069175) for "SPACER FOR WAFER" on Jul 08, 2024. With publication no. WO/2025/036611, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TOMASCHKO, Jochen (Marksuhler Ring 4871126 Gaeufelden), PRITSCHOW, Marcus (Liststrasse 872622 Nuertingen), SCHULER, Raphael (Gartenstrasse 4872074 Tuebingen)
Abstract:
The invention relates to a method for producing a coupled wafer (100) having a spacer wafer (150) for protecting...