INTERNATIONAL PATENT: ROBERT BOSCH GMBH FILES APPLICATION FOR "MICROSENSOR DEVICE HAVING AT LEAST ONE ADDITIONAL BONDING WIRE IN A PROTECTIVE COMPOUND"

GENEVA, July 19 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2024/088356) for "MICROSENSOR DEVICE HAVING AT LEAST ONE ADDITIONAL BONDING WIRE IN A PROTECTIVE COMPOUND" on Dec 23, 2024. With publication no. WO/2025/149375, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DANNENBERG, Arne (Werastrasse 572555 Metzingen), MAIER, Bernhard (Weilstetter Weg 4570567 Stuttgart), HAUG, Daniel (Eichbergstr. 2572639 Neuffen), SCHOENHALS, Alexander (No. 455 Xing Long StreetSuzhou Jiangsu, Ji...