GENEVA, May 17 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2024/078964) for "METHOD FOR TRANSFERRING CHIPS OF A WAFER, AND CORRESPONDING DEVICE" on Oct 15, 2024. With publication no. WO/2025/098721, the details related to the patent application was published on May 15, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PINTER, Stefan (Bellinostr. 27/172764 Reutlingen)
Abstract:
The present invention relates to a method for transferring chips (120) of a wafer (100) onto a substrate (160), comprising: providing a wafer (100) having a plurality of c...