GENEVA, Aug. 18 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2024/087993) for "METHOD FOR PRODUCING A BONDED WAFER" on Dec 20, 2024. With publication no. WO/2025/168273, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TOMASCHKO, Jochen (Marksuhler Ring 4871126 Gaeufelden), PRITSCHOW, Marcus (Liststrasse 872622 Nuertingen), SCHULER, Raphael (Gartenstrasse 4872074 Tuebingen)
Abstract:
The invention relates to a method for producing a bonded wafer (100), the method comprising: ...