GENEVA, June 23 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2024/084725) for "METHOD FOR BONDING MICROSTRUCTURE ELEMENTS, AND MICROSTRUCTURE ASSEMBLY" on Dec 04, 2024. With publication no. WO/2025/125043, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SCHELLING, Christoph (Schafgaerten 2370619 Stuttgart), ENGELHART, Peter (Am Saraisenbrunnen 3472813 St. Johann), WINDEN, Andreas (Moserstr. 5/172760 Reutlingen)
Abstract:
The invention relates to a method for bonding (14) mic...