GENEVA, Feb. 4 -- RN2 TECHNOLOGIES CO., LTD. (11 Dongtansandan 9-gil,Hwaseong-si,Gyeonggi-do 18487), (주) 알엔투테크놀로지 (경기도화성시동탄산단9길 11) filed a patent application (PCT/KR2024/010415) for "METHOD FOR FORMING CONDUCTIVE WIRING LAYER USING LIGHT SINTERING AND CONDUCTIVE WIRING LAYER FORMED BY USING SAME" on Jul 19, 2024. With publication no. WO/2025/023632, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....