INTERNATIONAL PATENT: RF360 SINGAPORE PTE. LTD. FILES APPLICATION FOR "METALLIZATION STRUCTURE HAVING AN OUTER METALLIZATION LAYER COMPRISING NICKEL AND PLATINUM LAYERS TO REDUCE INTER-METAL COMPOUND FORMATION"

GENEVA, Aug. 12 -- RF360 SINGAPORE PTE. LTD. (9 Raffles Place, #26-01 Republic PlazaSingapore 048619) filed a patent application (PCT/SG2025/050046) for "METALLIZATION STRUCTURE HAVING AN OUTER METALLIZATION LAYER COMPRISING NICKEL AND PLATINUM LAYERS TO REDUCE INTER-METAL COMPOUND FORMATION" on Jan 21, 2025. With publication no. WO/2025/165295, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YONG, Poh Hoong (5775 Morehouse DriveSan Diego, California 92121)

Abstract: A metallization structure having an outer metallizat...