INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SAME, WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, July 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/001155) for "SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SAME, WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Jan 17, 2024. With publication no. WO/2025/154212, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organ...