GENEVA, Sept. 16 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/008093) for "SOLDER RESIST EVALUATION MODEL, SOLDER RESIST EVALUATION METHOD, SOLDER RESIST COMPOSITION SELECTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SOLDER RESIST COMPOSITION" on Mar 04, 2024. With publication no. WO/2025/186876, the details related to the patent application was published on Sep 11, 2025.
Notably, the patent application was submitted under the International Patent Classificat...