INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SEAL STRUCTURE BETWEEN DISSIMILAR MATERIALS AND METHOD FOR MANUFACTURING SEAL STRUCTURE BETWEEN DISSIMILAR MATERIALS"

GENEVA, Feb. 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/026301) for "SEAL STRUCTURE BETWEEN DISSIMILAR MATERIALS AND METHOD FOR MANUFACTURING SEAL STRUCTURE BETWEEN DISSIMILAR MATERIALS" on Jul 24, 2025. With publication no. WO/2026/028926, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prope...