GENEVA, March 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/032242) for "RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING RESIN COMPOSITION" on Sep 04, 2023. With publication no. WO/2025/052516, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....