INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE"

GENEVA, Aug. 25 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/005249) for "MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE" on Feb 15, 2024. With publication no. WO/2025/173170, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAIRA Arisa (c/o Resona...