GENEVA, Jan. 6 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2025/022889) for "METHOD FOR PRODUCING COMPOSITE SHEET, COMPOSITE SHEET, BONDING METHOD, AND BONDED BODY" on Jun 25, 2025. With publication no. WO/2026/004922, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inven...