INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR PREDICTING OCCURRENCE RATE OF CRACKING, METHOD FOR SELECTING RESIN MATERIAL AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT"

GENEVA, Nov. 24 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/017831) for "METHOD FOR PREDICTING OCCURRENCE RATE OF CRACKING, METHOD FOR SELECTING RESIN MATERIAL, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT" on May 14, 2024. With publication no. WO/2025/238721, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wor...