INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT INTERMEDIATE, INTERPOSER WITH DUMMY PATTERN SECTION AND RESIN COMPOSITION FOR UNDERFILL"

GENEVA, Feb. 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/027448) for "METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT INTERMEDIATE, INTERPOSER WITH DUMMY PATTERN SECTION, AND RESIN COMPOSITION FOR UNDERFILL" on Jul 31, 2024. With publication no. WO/2026/028365, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is...