GENEVA, Oct. 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/015028) for "METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, BONDING MATERIAL AND CARRIER USED IN METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE" on Apr 15, 2024. With publication no. WO/2025/220084, the details related to the patent application was published on Oct 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...