INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE COMPOSITION, PROTECTIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE"

GENEVA, Aug. 18 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/001687) for "ADHESIVE COMPOSITION, PROTECTIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE" on Jan 21, 2025. With publication no. WO/2025/169708, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inven...