INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE COMPOSITION, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE"

GENEVA, May 5 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/037443) for "ADHESIVE COMPOSITION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE" on Oct 21, 2024. With publication no. WO/2025/089237, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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