GENEVA, Nov. 18 -- RESMED ASIA PTE. LTD. (3 Tuas Avenue 2Singapore 639443) filed a patent application (PCT/SG2025/050307) for "MODULAR HEADGEAR COMPONENTS FOR HEADGEAR" on May 07, 2025. With publication no. WO/2025/234943, the details related to the patent application was published on Nov 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LEE, Chuan Foong (c/o Resmed Asia Pte. Ltd.3 Tuas Avenue 2Singapore 639443), RAMDHAN, Deden (c/o Resmed Asia Pte. Ltd.3 Tuas Avenue 2Singapore 639443)
Abstract: The present disclosure concerns a headgear, comprising a crown loop configured to circumscribe...