INTERNATIONAL PATENT: REPLA INC., 주식회사 리플라 FILES APPLICATION FOR "APPARATUS FOR DECOMPOSING POLYMER COMPOUND BY USING BIOCHEMICALLY ACTING SOLVENT"

GENEVA, March 25 -- REPLA INC. (219ho, 280 Daehak-roGyeongsan-siGyeongsangbuk-do 38541), 주식회사 리플라 (경상북도경산시대학로 280, 219호) filed a patent application (PCT/KR2024/014035) for "APPARATUS FOR DECOMPOSING POLYMER COMPOUND BY USING BIOCHEMICALLY ACTING SOLVENT" on Sep 13, 2024. With publication no. WO/2025/058474, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUH, Dong Eun (809ho, 237 Yeongtong-ro, Yeon...