INTERNATIONAL PATENT: REFACTURE, INC. FILES APPLICATION FOR "METHODS FOR SEPARATING AN INPUT FEEDSTOCK USING THERMAL PLASMA AND SYSTEMS THEREOF"

GENEVA, Dec. 24 -- REFACTURE, INC. (3029 M St, Suite 201Washington, Ohio 20007) filed a patent application (PCT/US2025/032983) for "METHODS FOR SEPARATING AN INPUT FEEDSTOCK USING THERMAL PLASMA AND SYSTEMS THEREOF" on Jun 10, 2025. With publication no. WO/2025/259657, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SANTOIANNI, Jim (3029 M St, Suite 201Washington, District of Columbia 20007), NARSAVIDZE, Nicholas (3029 M St, Suite 201Washington, District of Columbia 20007)

Abstract: There is provided a method for separat...