INTERNATIONAL PATENT: RAON SEMICONDUCTOR CO., LTD., (주)라온반도체 FILES APPLICATION FOR "POWER MODULE HAVING DUAL-SIDE COOLING STRUCTURE"

GENEVA, March 25 -- RAON SEMICONDUCTOR CO., LTD. (B-3F, 35, Pangyo-ro 255beon-gil,Bundang-gu, Seongnam-si,Gyeonggi-do 13486), (주)라온반도체 (경기도성남시 분당구판교로255번길 35, B동 3층) filed a patent application (PCT/KR2024/009064) for "POWER MODULE HAVING DUAL-SIDE COOLING STRUCTURE" on Jun 28, 2024. With publication no. WO/2025/058194, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG...