GENEVA, June 4 -- RANPAK CORP. (7990 Auburn RoadConcord Township, Ohio 44077) filed a patent application (PCT/US2024/056562) for "PACKAGING SYSTEM AND METHOD FOR EXPANDABLE PADDED MAILERS" on Nov 19, 2024. With publication no. WO/2025/111286, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WELTEN, Johannes Egbertus Gerardus (Hemelrijkstraat 126301AK Valkenburg), JACOBS, Jannick Henric Marie (Hoekweg 256231LL Meerssen)

Abstract: A packaging system that enables a packer to open a packaging envelope with one hand and inse...