INTERNATIONAL PATENT: RADROCK (CHONGQING) MICROELECTRONICS CO., LTD., 锐石创芯（重庆）微电子有限公司 FILES APPLICATION FOR "CHIP PACKAGE STRUCTURE AND RADIO FREQUENCY FRONT-END MODULE"

GENEVA, Jan. 4 -- RADROCK (CHONGQING) MICROELECTRONICS CO., LTD. (No. 500-1, Fangzheng Avenue, Fuxing StreetLiangjiang New District, Chongqing 401147), 锐石创芯（重庆）微电子有限公司 (中国重庆市两江新区复兴街道方正大道500号附1号) filed a patent application (PCT/CN2025/092160) for "CHIP PACKAGE STRUCTURE AND RADIO FREQUENCY FRONT-END MODULE" on Apr 29, 2025. With publication no. WO/2026/001294, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the Internati...