INTERNATIONAL PATENT: QUANTINUUM LLC FILES APPLICATION FOR "INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) SUBSYSTEM"

GENEVA, Oct. 1 -- QUANTINUUM LLC (303 S. Technology CourtBroomfield, Colorado 80021) filed a patent application (PCT/US2024/049912) for "INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) SUBSYSTEM" on Oct 04, 2024. With publication no. WO/2025/198642, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DEEN, David (c/o Quantinuum LLC303 S. Technology CourtBroomfield, Colorado 80021), SWALLOWS, Matthew (c/o Quantinuum LLC303 S. Technology CourtBroomfield, Colorado 80021), ...