INTERNATIONAL PATENT: QUALCOMM TECHNOLOGIES, INC., RF360 SINGAPORE PTE. LTD. FILES APPLICATION FOR "DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEPAGE INTO AIR CAVITY AND RELATED FABRICATION METHODS"

GENEVA, March 25 -- QUALCOMM TECHNOLOGIES, INC. (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), RF360 SINGAPORE PTE. LTD. (9 Raffles Place, #26-01Republic PlazaSingapore 048619) filed a patent application (PCT/US2024/044620) for "DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEPAGE INTO AIR CAVITY, AND RELATED FABRICATION METHODS" on Aug 30, 2024. With publication no. WO/2025/058865, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HOO, Yeng Kwan (5775 Morehous...