INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "UPLINK BASED POSITIONING DURING DEMODULATED REFERENCE SIGNAL BUNDLING"

GENEVA, March 18 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/043178) for "UPLINK BASED POSITIONING DURING DEMODULATED REFERENCE SIGNAL BUNDLING" on Aug 21, 2024. With publication no. WO/2025/054001, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KUMAR, Akash (5775 Morehouse DriveSan Diego, California 92121), EDGE, Stephen William (5775 Morehouse DriveSan Diego, California 92121), BANSAL, Hargovind Prasad (5775 ...