INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "UPLINK AND DOWNLINK DATA PLANE ASPECTS"

GENEVA, Nov. 26 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/029853) for "UPLINK AND DOWNLINK DATA PLANE ASPECTS" on May 16, 2025. With publication no. WO/2025/240919, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KANAMARLAPUDI, Sitaramanjaneyulu (QUALCOMM IncorporatedATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), MEYLAN, Arnaud (QUALCOMM IncorporatedATTN: Internatio...