INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "TECHNIQUES FOR PARALLEL BINARY SHAPING"

GENEVA, Nov. 18 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/019823) for "TECHNIQUES FOR PARALLEL BINARY SHAPING" on Mar 13, 2025. With publication no. WO/2025/235082, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BAIK, Eugene (5775 Morehouse DriveSan Diego, California 92121-1714), VAN NEE, Didier Johannes Richard (5775 Morehouse DriveSan Diego, California 92121-1714)

Abstract: This disclosure provides methods...