INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "TECHNIQUES FOR ASSOCIATING MULTI-MODAL DATA IN WIRELESS COMMUNICATIONS"

GENEVA, June 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/053936) for "TECHNIQUES FOR ASSOCIATING MULTI-MODAL DATA IN WIRELESS COMMUNICATIONS" on Oct 31, 2024. With publication no. WO/2025/117128, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Hyun Yong (QUALCOMM IncorporatedATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), TINNAKORNSRISUPHAP, Peerapol (QUALCOMM ...