INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SUBSTRATES INCLUDING RAISED INTERCONNECTS DISPOSED ON A DIE-SIDE SURFACE TO SUPPORT INCREASED INTERCONNECT DENSITY AND RELATED METHODS"

GENEVA, Aug. 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/011793) for "SUBSTRATES INCLUDING RAISED INTERCONNECTS DISPOSED ON A DIE-SIDE SURFACE TO SUPPORT INCREASED INTERCONNECT DENSITY AND RELATED METHODS" on Jan 16, 2025. With publication no. WO/2025/165577, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALDRETE, Manuel (5775 Morehouse DriveSan Diego, California 92121), PATIL, Aniket (5775 Morehouse DriveSa...