INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SUBSTRATE STRUCTURE INCLUDING- STACKED SUBSTRATES DISPOSED IN A SHELL"

GENEVA, June 25 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/057717) for "SUBSTRATE STRUCTURE INCLUDING- STACKED SUBSTRATES DISPOSED IN A SHELL" on Nov 27, 2024. With publication no. WO/2025/128335, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Yujen (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), SUN, Yangyang (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92...