INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SUB-BAND FULL-DUPLEX GRANULARITY"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/035357) for "SUB-BAND FULL-DUPLEX GRANULARITY" on Jun 25, 2024. With publication no. WO/2025/024078, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IBRAHIM, Abdelrahman Mohamed Ahmed Mohamed (5775 Morehouse DriveSan Diego, California 92121), ABDELGHAFFAR, Muhammad Sayed Khairy (5775 Morehouse DriveSan Diego, California 92121), ABOTABL, Ahmed Attia (5775...