INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SUB-BAND FULL DUPLEX FOR MULTIPLE TRANSMISSION RECEPTION POINT TRANSMISSION SCHEMES"

GENEVA, June 11 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/050732) for "SUB-BAND FULL DUPLEX FOR MULTIPLE TRANSMISSION RECEPTION POINT TRANSMISSION SCHEMES" on Oct 10, 2024. With publication no. WO/2025/117045, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ABDELGHAFFAR, Muhammad Sayed Khairy (5775 Morehouse DriveSan Diego, California 92121), KHOSHNEVISAN, Mostafa (5775 Morehouse DriveSan Diego, California 921...