INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SQUARE THERMAL VIA"

GENEVA, Aug. 19 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/013217) for "SQUARE THERMAL VIA" on Jan 27, 2025. With publication no. WO/2025/170782, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIN, Heun Gun (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), KANG, Kyudong (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714)

Abstract: Disclosed are examples of...