INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SPATIAL AWARENESS VIA GAP FILLING"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/031725) for "SPATIAL AWARENESS VIA GAP FILLING" on May 30, 2024. With publication no. WO/2025/024045, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BALASUBRAMANIAN, Anantharaman (5775 Morehouse DriveSan Diego, California 92121-1714), VASSILOVSKI, Dan (5775 Morehouse DriveSan Diego, California 92121-1714)

Abstract: Techniques for providing spatial aw...