INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SINGLE HYBRID SYSTEM-ON-CHIP (SOC) DIE STRUCTURE WITH HIGH MEMORY BANDWIDTH AND DENSITY"

GENEVA, Nov. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/018600) for "SINGLE HYBRID SYSTEM-ON-CHIP (SOC) DIE STRUCTURE WITH HIGH MEMORY BANDWIDTH AND DENSITY" on Mar 05, 2025. With publication no. WO/2025/226352, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KANG, Woo Tag (5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhongze (5775 Morehouse DriveSan Diego, California 92121-1714), BADAROGLU, M...