INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SHALLOW TRENCH ISOLATION (STI) FREE STRUCTURES FOR ADVANCED SEMICONDUCTOR TECHNOLOGIES"

GENEVA, Dec. 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/030744) for "SHALLOW TRENCH ISOLATION (STI) FREE STRUCTURES FOR ADVANCED SEMICONDUCTOR TECHNOLOGIES" on May 23, 2025. With publication no. WO/2025/264365, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUN, Yan (5775 Morehouse DriveSan Diego, California 92121-1714), NARASIMHA, Shreesh (5775 Morehouse DriveSan Diego, California 92121-1714), LEE, Wei-Ta ...