INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SENSOR-BASED ULTRASONIC COUPLING LAYER EVALUATION AND RELATED USER INTERFACE FUNCTIONALITY"

GENEVA, Aug. 19 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/058534) for "SENSOR-BASED ULTRASONIC COUPLING LAYER EVALUATION AND RELATED USER INTERFACE FUNCTIONALITY" on Dec 04, 2024. With publication no. WO/2025/170666, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MCQUILLAN, Kaylin (c/o Qualcomm Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), BUCHAN, Nicholas (c/o Qualcomm Incorporated5775 M...