INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SEMICONDUCTOR DIE HAVING A DIE INTERCONNECT AND A DIE LEVEL DISTRIBUTION METALLIZATION LAYER INCLUDING A METAL LINE AND A METAL PAD"

GENEVA, Oct. 14 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/020411) for "SEMICONDUCTOR DIE HAVING A DIE INTERCONNECT AND A DIE LEVEL DISTRIBUTION METALLIZATION LAYER INCLUDING A METAL LINE AND A METAL PAD" on Mar 18, 2025. With publication no. WO/2025/212267, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUN, Yangyang (5775 Morehouse DriveSan Diego, California 92121), HU, Wei (5775 Morehouse DriveSan Diego, Ca...