INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "RATE MATCHING AND SIGNALING IN PROBABILITY CONSTELLATION SHAPING IN WI-FI SYSTEMS"

GENEVA, Nov. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/025992) for "RATE MATCHING AND SIGNALING IN PROBABILITY CONSTELLATION SHAPING IN WI-FI SYSTEMS" on Apr 23, 2025. With publication no. WO/2025/226828, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Jialing Li (5775 Morehouse DriveSan Diego, California 92121-1714), BAIK, Eugene (5775 Morehouse DriveSan Diego, California 92121-1714), TIAN, Bin (5775 ...