INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBUTION LAYER(S) (RDL(S)) FOR ALIGNING CAPACITOR TERMINALS CONNECTIONS TO SEMICONDUCTOR DIE IN AN INTEGRATED CIRCUIT (IC) PACKAGE AND RELATED FABRICATION METHODS"

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/010717) for "PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBUTION LAYER(S) (RDL(S)) FOR ALIGNING CAPACITOR TERMINALS CONNECTIONS TO SEMICONDUCTOR DIE IN AN INTEGRATED CIRCUIT (IC) PACKAGE, AND RELATED FABRICATION METHODS" on Jan 08, 2025. With publication no. WO/2025/159900, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket...