INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE SUBSTRATE"

GENEVA, Sept. 30 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/014310) for "PACKAGE SUBSTRATE" on Feb 03, 2025. With publication no. WO/2025/198720, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KANG, Kuiwon (Qualcomm Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), BCHIR, Omar James (Qualcomm Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), WE, Hong Bok (Qualcomm Incorporated...