INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE"

GENEVA, March 10 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/037866) for "PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE" on Jul 12, 2024. With publication no. WO/2025/048965, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121), KIM, Michelle Yejin (5775 Morehouse DriveSa...