INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE INTERCONNECT STRUCTURE"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/039295) for "PACKAGE INTERCONNECT STRUCTURE" on Jul 25, 2025. With publication no. WO/2026/025049, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), BUOT, Joan Rey Villarba (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhijie (QUA...