INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE COMPRISING AN INTEGRATED DEVICE, A SUBSTRATE AND A HEAT SINK"

GENEVA, Dec. 10 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/029370) for "PACKAGE COMPRISING AN INTEGRATED DEVICE, A SUBSTRATE AND A HEAT SINK" on May 14, 2025. With publication no. WO/2025/250363, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Zhijie (5775 Morehouse DriveSan Diego, California 92121-1714), KUMAR, Rajneesh (5775 Morehouse DriveSan Diego, California 92121-1714), ALDRETE, Manuel (5775 Morehou...