INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK"

GENEVA, April 1 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/045133) for "PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK" on Sep 04, 2024. With publication no. WO/2025/064213, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WE, Hong Bok (5775 Morehouse DriveSan Diego, California 92121-1714), BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121-1714), LEE, Sang-Jae (5775 Morehouse Dr...