INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK"

GENEVA, March 25 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/044825) for "PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK" on Aug 30, 2024. With publication no. WO/2025/058871, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Michelle Yejin (5775 Morehouse DriveSan Diego, California 92121-1714), WE, Hong Bok (5775 Morehouse DriveSan Diego, California 92121-1714), BUOT, Joan Rey Villarba (5775 M...